[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Integrated wafer thinning process with TSV electroplating for 3D stacking
Li, Cao, Zhou, Shengjun, Chen, Run, Peng, Tao, Wang, Xuefang, Liu, ShengYear:
2012
Language:
english
DOI:
10.1109/icept-hdp.2012.6474764
File:
PDF, 924 KB
english, 2012