Thiol-based self-assembly nanostructures in promoting interfacial adhesion for copper-epoxy joint
Wong, Cell K. Y., Yuen, Matthew M. F., Xu, BingVolume:
94
Year:
2009
Language:
english
Journal:
Applied Physics Letters
DOI:
10.1063/1.3167358
File:
PDF, 706 KB
english, 2009