Spatially-averaged model for plasma etch processes: Comparison of different approaches to electron kinetics
Ahlrichs, P.Volume:
16
Language:
english
Journal:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
DOI:
10.1116/1.581187
Date:
May, 1998
File:
PDF, 418 KB
english, 1998