Spatially-averaged model for plasma etch processes:...

Spatially-averaged model for plasma etch processes: Comparison of different approaches to electron kinetics

Ahlrichs, P.
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Volume:
16
Language:
english
Journal:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
DOI:
10.1116/1.581187
Date:
May, 1998
File:
PDF, 418 KB
english, 1998
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