[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Low-frequency testing of through silicon vias for defect diagnosis in three-dimensional integration circuit stacking technology
Xu, Yichao, Miao, Min, Fang, Runiu, Sun, Xin, Zhu, Yunhui, Sun, Minggang, Wang, Guanjiang, Jin, YufengYear:
2014
Language:
english
DOI:
10.1109/ectc.2014.6897574
File:
PDF, 2.56 MB
english, 2014