[IEEE 2011 International Conference on Simulation of...

  • Main
  • [IEEE 2011 International Conference on...

[IEEE 2011 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Osaka, Japan (2011.09.8-2011.09.10)] 2011 International Conference on Simulation of Semiconductor Processes and Devices - Exploring MOL design options for a 20nm CMOS technology using TCAD

Scholze, Andreas, Furkay, Stephen, Kim, Seong-Dong, Jain, Sameer
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2011
Language:
english
DOI:
10.1109/sispad.2011.6035059
File:
PDF, 596 KB
english, 2011
Conversion to is in progress
Conversion to is failed