[IEEE 2005 4th International Symposium on Environmentally Conscious Design and Inverse Manufacturing - Tokyo, Japan (12-14 Dec. 2005)] 2005 4th International Symposium on Environmentally Conscious Design and Inverse Manufacturing - Thermal Fatigue Life of Sn-2Ag Solder Bump with Small Al Addition
Serizawa, K., Yoshimi, K., Okamoto, M., Narita, T., Tanaka, J.Year:
2005
Language:
english
DOI:
10.1109/ecodim.2005.1619297
File:
PDF, 3.22 MB
english, 2005