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[IEEE 2012 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan) - Kyoto, Japan (2012.12.10-2012.12.12)] 2012 2nd IEEE CPMT Symposium Japan - Low-temperature bonding of laser diode chips using atmospheric-pressure plasma activation of flat topped Au stud bumps with smooth surfaces
Yamamoto, Michitaka, Sato, Takeshi, Higurashi, Eiji, Suga, Tadatomo, Sawada, RenshiYear:
2012
Language:
english
DOI:
10.1109/icsj.2012.6523387
File:
PDF, 234 KB
english, 2012