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[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Compact thermal model of double-layer microchannel heat sink with high temperature uniformity for multiple LEDs
Zhu, Yongming, Hu, Run, Hu, Jinyan, Luo, XiaobingYear:
2014
Language:
english
DOI:
10.1109/icept.2014.6922929
File:
PDF, 1.01 MB
english, 2014