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[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - The Effect of IMC Microstructure of Solder Joint on the Mechanical Drop Performance in SnxAgCu and SnAgCuX CSP Package

Yi-Shao Lai,, Chen, P.C, Chang-Lin Yeh,, Lee, J.C.B.
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Year:
2006
Language:
english
DOI:
10.1109/ectc.2006.1645926
File:
PDF, 1.43 MB
english, 2006
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