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[IEEE 2006 IEEE Workship on Signal Propagation on Interconnects - Berlin, Germany (2006.05.9-2006.05.12)] 2006 IEEE Workship on Signal Propagation on Interconnects - Analysis and Design of Electromagnetic Bandgap (EBG) Structures for Power Plane Isolation Using 2D Dispersion Diagrams and Scalability
Engin, A., Toyota, Yoshitaka, Kim, Tae, Swaminathan, MadhavanYear:
2006
Language:
english
DOI:
10.1109/spi.2006.289196
File:
PDF, 4.27 MB
english, 2006