Study of temperature dependence of bump bonding for the BTeV pixel detector
Turqueti, M., Cihangir, S., Kwan, S., Appel, J.A., Cardoso, G., Christian, D.C., Hall, B.K., Zimmermann, S.Volume:
51
Language:
english
Journal:
IEEE Transactions on Nuclear Science
DOI:
10.1109/tns.2004.834709
Date:
October, 2004
File:
PDF, 1.71 MB
english, 2004