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[IEEE 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, Jiangsu, China (2009.07.6-2009.07.10)] 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Effect of 0.05% Cr on intermetallic compound layer growth for Sn-Ag-Cu Lead-free Solder joint during isothermal aging
Guobiao Su,, Yongjiu Han,, Chunyan Wang,, Hongbin Wang,, Xicheng Wei,Year:
2009
Language:
english
DOI:
10.1109/ipfa.2009.5232623
File:
PDF, 3.89 MB
english, 2009