Analysis of RF MEMS switch packaging Process for yield improvement
Mercado, L.L., Kuo, S.-M., Tien-Yu Lee,, Lee, R.Volume:
28
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2004.841654
Date:
February, 2005
File:
PDF, 1.01 MB
english, 2005