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[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Effect of high temperature thermal aging on microstructural evolution of Sn3Ag0.5Cu/Cu solder joints
Li, Hailong, Fu, Mingliang, Zhu, Mei, An, Rong, Wang, Chunqing, Zhang, RuiYear:
2013
Language:
english
DOI:
10.1109/icept.2013.6756579
File:
PDF, 2.30 MB
english, 2013