[IEEE 2013 14th International Conference on Electronic...

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[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Unsteady-state analysis of temperature field of electronic package with power chip

Kaikun, Wang, Lei, Wang, Lu, Wang, Yuzhi, Wang
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Year:
2013
Language:
english
DOI:
10.1109/icept.2013.6756508
File:
PDF, 461 KB
english, 2013
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