![](/img/cover-not-exists.png)
[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Unsteady-state analysis of temperature field of electronic package with power chip
Kaikun, Wang, Lei, Wang, Lu, Wang, Yuzhi, WangYear:
2013
Language:
english
DOI:
10.1109/icept.2013.6756508
File:
PDF, 461 KB
english, 2013