[IEEE 2009 Twenty-Fourth Annual IEEE Applied Power Electronics Conference and Exposition (APEC) - Washington, DC, USA (2009.02.15-2009.02.19)] 2009 Twenty-Fourth Annual IEEE Applied Power Electronics Conference and Exposition - A Busbar Like Power Module Based On 3D Chip On Chip Hybrid Integration
Vagnon, E., Jeannin, P.O., Avenas, Y., Crebier, J.C., Guepratte, K.Year:
2009
Language:
english
DOI:
10.1109/apec.2009.4802960
File:
PDF, 2.68 MB
english, 2009