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[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Evaluation of Thermal Resistance of TIMs in Functional Packages Using a Thermal Transient Method
Somasundaram, Sivanand, Tay, A. A. O., Kandasamy, RaviYear:
2008
Language:
english
DOI:
10.1109/eptc.2008.4763639
File:
PDF, 4.24 MB
english, 2008