![](/img/cover-not-exists.png)
Heat transfer study of submicro-encapsulated PCM plate for food packaging application
Hoang, H.M., Leducq, D., Pérez-Masia, R., Lagaron, J.M., Gogou, E., Taoukis, P., Alvarez, G.Volume:
52
Language:
english
Journal:
International Journal of Refrigeration
DOI:
10.1016/j.ijrefrig.2014.07.002
Date:
April, 2015
File:
PDF, 1.91 MB
english, 2015