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[IEEE 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2012.10.24-2012.10.26)] 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Detection of micro defects in 3dic packages by means of non-destructive 3D X-ray
Mei-Chin Lee,, Wan-Ting Chen,, Chun-Tang Lin,, Ming-Hsien Yang,, Jeng-Yuan Lai,Year:
2012
Language:
english
DOI:
10.1109/impact.2012.6420261
File:
PDF, 1.35 MB
english, 2012