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[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Thermal resistance analysis of high power LED module under power cycling test
Huang, Hao, Cai, Miao, Tian, Kunmiao, Chen, Yunchao, Jia, Hongliang, Yang, DaoguoYear:
2014
Language:
english
DOI:
10.1109/icept.2014.6922927
File:
PDF, 644 KB
english, 2014