[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Noise coupling of through-via in silicon and glass interposer
Lee, Manho, Cho, Jonghyun, Kim, Joohee, Kim, Joungho, Kim, JiseongYear:
2013
Language:
english
DOI:
10.1109/ectc.2013.6575821
File:
PDF, 651 KB
english, 2013