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[IEEE 2011 Materials for Advanced Metallization (MAM) - Dresden, Germany (2011.05.8-2011.05.12)] 2011 IEEE International Interconnect Technology Conference - CVD and ALD of Cobalt-tungsten alloy film as a novel Copper diffusion barrier
Shimizu, Hideharu, Sakoda, Kaoru, Shimogaki, YukihiroYear:
2011
Language:
english
DOI:
10.1109/iitc.2011.5940343
File:
PDF, 684 KB
english, 2011