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[IEEE 2006 International Conference on Electronic Materials and Packaging - Kowloon, China (2006.12.11-2006.12.14)] 2006 International Conference on Electronic Materials and Packaging - Assessment on Reliability of 1.0mm pitch BGA Package double-side assembly

Ye, Yuming, Liu, Sang, Chen, Limin, Zhang, Jian, Xiang, Zhao, Song, Zhiwei
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Year:
2006
Language:
english
DOI:
10.1109/emap.2006.4430701
File:
PDF, 6.29 MB
english, 2006
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