[IEEE 2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC 2013) - Yokohama (2013.1.22-2013.1.25)] 2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC) - Block-level designs of die-to-wafer bonded 3D ICs and their design quality tradeoffs
Athikulwongse, Krit, Dae Hyun Kim,, Moongon Jung,, Sung Kyu Lim,Year:
2013
Language:
english
DOI:
10.1109/aspdac.2013.6509680
File:
PDF, 1.29 MB
english, 2013