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[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Thermal cycling effect on intermetallic formation with various surface finish of micro bump interconnect for 3D package
Chan, Mu-Hsuan, Liao, Yi-Chian, Lin, Chun-Tang, Chuang, Kuan-Weir, Huang, Huei-Nuan, Yeh, Chi-Tung, Tseng, Wen-Tsung, Lai, Jeng-YuanYear:
2013
Language:
english
DOI:
10.1109/ectc.2013.6575880
File:
PDF, 881 KB
english, 2013