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[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Study on silver sintered die attach material with different metal surfaces for high temperature and high pressure (300°c/30kpsi) applications
Wai, Leong Ching, Seit, Wen Wei, Jian Rong, Eric Phua, Ding, Mian Zhi, Rao, Vempati Srinivasa, MinWoo, Daniel RheeYear:
2013
Language:
english
DOI:
10.1109/eptc.2013.6745738
File:
PDF, 5.39 MB
english, 2013