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[IEEE 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, Jiangsu, China (2009.07.6-2009.07.10)] 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Unusual defects, generated by wafer sawing: Diagnosis, mechanisms and how to distinguish from related failures
Jacob, Peter, Rothkirch, WernerYear:
2009
Language:
english
DOI:
10.1109/ipfa.2009.5232563
File:
PDF, 6.97 MB
english, 2009