[IEEE Technology (ICICDT) - Kaohsiung, Taiwan (2011.05.2-2011.05.4)] 2011 IEEE International Conference on IC Design & Technology - On the impact of the edge profile of interconnects on the occurrence of passivation cracks of plastic-encapsulated electronic power devices
Ackaert, Jan, Vanderstraeten, Daniel, Vandevelde, BartYear:
2011
Language:
english
DOI:
10.1109/icicdt.2011.5783216
File:
PDF, 1.29 MB
english, 2011