Novel Three-Dimensional Packaging Approaches Using...

IEEE Transactions on Microwave Theory and Techniques 2010 / 12

Novel Three-Dimensional Packaging Approaches Using Magnetically Aligned Anisotropic Conductive Adhesive for Microwave Applications

Moon, Sungwook, Chappell, William J.
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Language:
english
Journal:
IEEE Transactions on Microwave Theory and Techniques
DOI:
10.1109/tmtt.2010.2086630
Date:
December, 2010
File:
PDF, 1.46 MB
english, 2010
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