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Bonding behavior of copper thick films containing lead-free glass frit on aluminum nitride substrates
Xinrui Xu, Hanrui Zhuang, Wenlan Li, Guojian JiangVolume:
30
Year:
2004
Language:
english
Pages:
5
DOI:
10.1016/j.ceramint.2003.07.012
File:
PDF, 190 KB
english, 2004