Thermomechanical study of AlCu based interconnect under...

Journal of Applied Physics 1997 Vol. 81; Iss. 3

Thermomechanical study of AlCu based interconnect under pulsed thermoelectric excitation

Phan, T., Dilhaire, S., Quintard, V., Lewis, D., Claeys, W.
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Volume:
81
Year:
1997
Language:
english
Journal:
Journal of Applied Physics
DOI:
10.1063/1.363985
File:
PDF, 536 KB
english, 1997
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