[IEEE 2009 IEEE International Reliability Physics Symposium - Montreal, QC, Canada (2009.04.26-2009.04.30)] 2009 IEEE International Reliability Physics Symposium - Temperature scaling of electromigration threshold product in Cu/low-K interconnects
Petitprez, E., Doyen, L., Ney, D.Year:
2009
Language:
english
DOI:
10.1109/irps.2009.5173368
File:
PDF, 235 KB
english, 2009