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[IEEE Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium - Austin, TX, USA (14-16 Oct. 1996)] Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium - A method for the measurement of chip to leadframe adhesion in LOC packages
Ahmad, S.S., Tongbi Jiang,, Moden, W., Breen, C., Reeder, J.Year:
1996
Language:
english
DOI:
10.1109/iemt.1996.559772
File:
PDF, 620 KB
english, 1996