Design, analysis, and development of novel...

IEEE Transactions on Advanced Packaging 2005 / 08 Vol. 28; Iss. 3

Design, analysis, and development of novel three-dimensional stacking WLCSP

Yuan, C.-A., Cheng Nan Han,, Ming-Chih Yew,, Chan-Yen Chou,, Kou-Ning Chiang,
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Volume:
28
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2005.852894
Date:
August, 2005
File:
PDF, 1.96 MB
english, 2005
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