[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Outgassing characterization of MEMS thin film packaging materials
Savornin, B., Baillin, X., Blanquet, E., Nuta, I., Patrice, D. Saint, Nicolas, P., Charvet, P. L., Pornin, J. LYear:
2013
Language:
english
DOI:
10.1109/ectc.2013.6575772
File:
PDF, 421 KB
english, 2013