Physical design and assembly process development of a...

IEEE Transactions on Components Packaging and Manufacturing Technology Part B 1997 / Nov. Vol. 20; Iss. 4

Physical design and assembly process development of a multichip package containing a light emitting diode (LED) array die

Bonda, R., Treliant Fang,, Kaskoun, K., Lytle, W.H., Marlin, B., Swan, G., Stafford, J.W., Tam, G.
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Volume:
20
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.641506
Date:
January, 1997
File:
PDF, 431 KB
english, 1997
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