3-D Structure Design and Reliability Analysis of Wafer...

IEEE Transactions on Components and Packaging Technologies 2007 / 03 Vol. 30; Iss. 1

3-D Structure Design and Reliability Analysis of Wafer Level Package With Stress Buffer Mechanism

Lee, Chang-Chun, Liu, Hsing-Chih, Chiang, Kuo-Ning
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Volume:
30
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2007.892083
Date:
March, 2007
File:
PDF, 1.26 MB
english, 2007
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