![](/img/cover-not-exists.png)
[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Dielectric composite material with good performance and process ability for embedding of active and passive components into PCBs
Park, Ryan, Cho, Seunghyun, Kress, Jurgen, Galster, NorbertYear:
2013
Language:
english
DOI:
10.1109/ectc.2013.6575744
File:
PDF, 1.23 MB
english, 2013