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[IEEE 2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - San Hose, CA, USA (2014.5.20-2014.5.23)] IEEE International Interconnect Technology Conference - Unique nondestructive inline metrology of TSVs by X-ray with model based library method
Umehara, Yasutoshi, Jin, WenYear:
2014
Language:
english
DOI:
10.1109/iitc.2014.6831877
File:
PDF, 559 KB
english, 2014