[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Development of a stacked WCSP package platform using TSV (Through Silicon Via) technology
Dunne, Rajiv, Takahashi, Yoshimi, Mawatari, Kazuaki, Matsuura, Masamitsu, Bonifield, Tom, Steinmann, Philipp, Stepniak, DaveYear:
2012
Language:
english
DOI:
10.1109/ectc.2012.6248967
File:
PDF, 712 KB
english, 2012