Geometric Variability of Nanoscale Interconnects and Its Impact on the Time-Dependent Breakdown of Cu/Low-$k$ Dielectrics
Lee, Shou-Chung, Oates, Anthony S., Chang, Kow-MingVolume:
10
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2010.2048031
Date:
September, 2010
File:
PDF, 802 KB
english, 2010