[IEEE 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA, USA (2011.10.23-2011.10.26)] 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems - 3D via modeling simplification on multilayer mid-planes
Li, Qian, Melde, Kathleen L., Yeh, Gong-Jong, Wu, Hui, Yang, YaochaoYear:
2011
Language:
english
DOI:
10.1109/epeps.2011.6100228
File:
PDF, 2.39 MB
english, 2011