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[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Co-W as an advanced barrier for intermetallics and electromigration in fine-pitch flipchip interconnections
Mishra, Dibyajat, Raj, P. Markondeya, Khan, Sadia, Kumbhat, Nitesh, Wang, Yushu, Addya, Suman, Pucha, Raghuram V, Choudhury, Abhishek, Sundaram, Venky, Tummala, RaoYear:
2011
Language:
english
DOI:
10.1109/ectc.2011.5898621
File:
PDF, 683 KB
english, 2011