[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Studies on the thermal cycling reliability of fine pitch Cu/SnAg double-bump flip chip assemblies on organic substrates: Experimental results and numerical analysis
Ho-Young Son,, Ilho Kim,, Park, Jin-Hyoung, Soon-Bok Lee,, Gi-Jo Jung,, Park, Byung-Jin, Kyung-Wook Paik,Year:
2008
Language:
english
DOI:
10.1109/ectc.2008.4550264
File:
PDF, 2.58 MB
english, 2008