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[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - iNEMI solder paste deposition project - First stage review optimizing solder paste printing for large and small components
Shouk,, Mohanty, Rita, Xiaodong Jiang,, Runsheng Mao,, Jeffery ChangBing Lee,, Chuan Xia,, Sweatman, Keith, Desmond Teoh,Year:
2009
Language:
english
DOI:
10.1109/impact.2009.5382261
File:
PDF, 1.51 MB
english, 2009