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[IEEE 1997 47th Electronic Components and Technology Conference - San Jose, CA, USA (18-21 May 1997)] 1997 Proceedings 47th Electronic Components and Technology Conference - Investigation on the effect of molding compounds on package delamination
Minjin Ko,, Myungwhan Kim,, Dongsuk Shin,, Yongioon Park,, Myungsun Moon,, Inhee Lim,Year:
1997
Language:
english
DOI:
10.1109/ectc.1997.606334
File:
PDF, 670 KB
english, 1997