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[IEEE 2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings - Shanghai, China (2006.10.23-2006.10.26)] 2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings - Tungsten carbides as a diffusion barrier for Cu metallization
Xie, Qi, Jiang, Yu-long, Detavernier, C., Van Meirhaeghe, R., Qu, Xin-pingYear:
2006
Language:
english
DOI:
10.1109/icsict.2006.306224
File:
PDF, 162 KB
english, 2006