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[IEEE 2013 IEEE International Symposium on Electromagnetic Compatibility - EMC 2013 - Denver, CO, USA (2013.08.5-2013.08.9)] 2013 IEEE International Symposium on Electromagnetic Compatibility - Automotive EMC analysis using the hybrid finite element boundary integral approach
Mologni, J.F., Kopp, M., Siqueira, C.L.R., Colin, A., Nogueira, A., Alves, M.A.R.Year:
2013
Language:
english
DOI:
10.1109/isemc.2013.6670499
File:
PDF, 1.87 MB
english, 2013