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[IEEE 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, China (2013.07.15-2013.07.19)] Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Failure analysis for via with solder bubble
Wang Yang,, Luo Daojun,Year:
2013
Language:
english
DOI:
10.1109/ipfa.2013.6599274
File:
PDF, 1.67 MB
english, 2013