[IEEE TRANSDUCERS 2011 - 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference - Beijing, China (2011.06.5-2011.06.9)] 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference - A wafer-level poly-sige-based thin film packaging technology demonstrated on a soi-based high-Q MEM resonator
Helin, Ph., Verbist, A., De Coster, J., Guo, B., Severi, S., Witvrouw, A., Haspeslagh, L., Tilmans, H.A.C., Naito, Y., Nakamura, K., Onishi, K.Year:
2011
Language:
english
DOI:
10.1109/transducers.2011.5969486
File:
PDF, 1.47 MB
english, 2011